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Chemical-mechanical planarization
Results: 22

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1	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICES Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-04-01 03:01:20 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating GlobalFoundries Wafer Back end of line Fraunhofer Society Copper plating Silicon Saxony
2	Management of Voids in Processing of Bonded Wafers Dr. Shari Farrens, Chief Scientist, EV Group Inc. Dr. Lawrence W. Kessler, President, Sonoscan, Inc. Abstract This paper discusses the origination and detection of bondi Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Microtechnology Acoustic microscopy Wafer Void Chemical-mechanical planarization Microfabrication Microelectromechanical systems Megasonic cleaning Photolithography Etching
3	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) 2 1 Add to Reading List Source URL: www.screening-fab.com Language: English - Date: 2016-02-10 06:01:49 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating Wafer GlobalFoundries Back end of line Fraunhofer Society
4	FRAUNHOFER-INSTITUT FÜR I nte g rierte S y steme un d B aue l ementete c hno l o g ie I I S B Towards 450 mm Add to Reading List Source URL: www.iisb.fraunhofer.de Language: English - Date: 2015-06-10 03:01:05 Microtechnology Visual arts Metalworking Etching Polishing Flatness Wafer Metrology Chemical-mechanical planarization Semiconductor device fabrication Technology Materials science
5	Chemical Mechanical Polishing (CMP) Metrology with Advanced Surface Profiler >>> Figure 1. The key matrices of metal chemical mechanical Add to Reading List Source URL: www.nanowerk.com Language: English - Date: 2011-11-12 18:00:00 Chemical-mechanical planarization Science Park Systems Wafer Profilometer Atomic force microscopy 1 micrometre Semiconductor device fabrication Technology Materials science
6	Education related articles Wendell, K., Kendall, A., Portsmore, M., Wright, C., Jarvin, L., & Rogers, C[removed]Embedding elementary school science instruction in engineering design problem solving. In S. Purzer, J. Str Add to Reading List Source URL: www.tufts.edu Language: English - Date: 2014-12-31 13:12:36 American Society for Engineering Education ASME Engineering Technology Semiconductor device fabrication Rogers Chemical-mechanical planarization
7	At The Edge EM EXPLORER Simulation of Wafer Topography Effects in Double Patterning Lithography Add to Reading List Source URL: emexplorer.net Language: English - Date: 2009-02-15 16:35:45 Science Multiple patterning Resist Wafer Finite-difference time-domain method Photolithography Chemical-mechanical planarization Semiconductor device fabrication Physics Technology
8	A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding Add to Reading List Source URL: deepblue.lib.umich.edu Language: English - Date: 2013-09-17 15:11:17 Technology Microelectromechanical systems Etching Wafer Microfabrication Deep reactive-ion etching Chemical-mechanical planarization Thermal oxidation Silicon on insulator Semiconductor device fabrication Materials science Microtechnology
9	Capabilities Service Details Specific application Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2015-01-15 19:37:11 Semiconductor device fabrication Nanotechnology Etching Microelectromechanical systems Transducers Surface micromachining Bulk micromachining Deep reactive-ion etching Chemical-mechanical planarization Materials science Microtechnology Technology
10	Robust TSV ViaMiddle and ViaReveal Process Integration Accomplished through Characterization and Management of Sources of Variation Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-27 18:47:55 Microtechnology Chemical-mechanical planarization Etching Back end of line Copper interconnect Through-silicon via Wafer Chemical vapor deposition Three-dimensional integrated circuit Semiconductor device fabrication Electronics Technology

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